Shares of Nvidia Corp. ( NVDA, Financial) fell more than 3% on Friday as investors worried about growing competition from ...

YorChip’s CTO and founder, Frank Dunlap said, “The Universal PHYTM design is optimized for power (5X) lower than UCIe-SP, ...

Nasdaq 100 E-Mini futures (NQH25) are trending up +0.54% this morning as investors digested earnings reports from big U.S.

A chip industrial professional surnamed Zhu said China's localization rate of chip packaging is indeed showing an increasing ... Institute of Applied Economics of the Shanghai Academy of Social ...

With advanced NoC tools, SoC designers will be able to address escalating design requirements with greater efficiency.

Steve Woo, distinguished inventor and fellow at Rambus, examines the benefits of a common substrate for communication, the ...

Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...

In the final days of the Joe Biden presidency, the Department of Commerce’s CHIPS and Science Act came to preliminary funding for several new companies including Infinera, Coherent, Corning and ...

Flip chip packaging is a widely used technology in the electronics industry, allowing for efficient connections between semiconductor chips and circuit boards. This method involves flipping the ...

Email: {parthap, grecuc, ivanov, res} @ece.ubc.ca The University of British Columbia’s System-on-a-Chip (SoC) Research lab has established itself as a world-class research centre for the design, ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

The progression of cellular modem technology is a great example of the increasing complexity of system-on-chip design, and the market pressure ... faced in the design of today’s wireless SoC platforms ...