With advanced NoC tools, SoC designers will be able to address escalating design requirements with greater efficiency.

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Flip chip packaging is a widely used technology in the electronics industry, allowing for efficient connections between semiconductor chips and circuit boards. This method involves flipping the ...

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

Shares of Nvidia Corp. ( NVDA, Financial) fell more than 3% on Friday as investors worried about growing competition from ...

GlobalFoundries is now planning to build a $575 million chip packaging and testing center at the site as well. GlobalFoundries CEO Thomas Caulfield, left, and Gov. Kathy Hochul, right, stop for a ...