Semiconductor Engineering

Mastering 3D-IC Verification Complexity

The verification gap emerges not from a lack of computational power but from the multiphysics nature of 3D-IC behavior.

Visualizing band structures in nanostructures: Extending band theory to imperfect periodic and bent systems

An international collaborative research group has developed a new computational method to visualize the electronic states of ...
IEEE

Quantum Computing Method for Solving Electromagnetic Problems Based on the Finite Element Method

Abstract: Applying quantum computation to solve electromagnetic (EM) problems is still at an early age. Recently, an initial study on applying quantum computation to solve the finite element method ...
IEEE

Benchmarking Machine Learning Methods Against Finite Element and Empirical Models for Predicting Solder Joint Characteristic Life

Abstract: Accurate prediction of solder joint characteristic life is crucial for ensuring the reliability of electronic assemblies, especially under severe environmental conditions. This study ...
C&EN

Improved Rate Capability for Dry Thick Electrodes through Finite Elements Method and Machine Learning Coupling

Article Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to ...