HBM is a reliability bottleneck, requiring greater visibility into individual bonds and TSVs, and more sophisticated SI/PI ...

Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

how data center AI is growing rapidly; how almost everyone says they could grow revenue faster with more compute; and, that there are challenging, stubborn bottlenecks to data center AI growth, ...

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible ...

NASA’s lunar network will leverage Delay/Disruption Tolerant Networking to maintain signal integrity between rovers, astronauts, satellites, and more. 4G/5G LTE RF and optical inter-satellite links ...

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...

Chip security must be designed in from the start, with clear requirements that connect architecture, verification, software, manufacturing, and field deployment. AI is expanding both the scale and ...

AI has pushed security to the forefront, helping attackers find vulnerabilities in chips and the chip industry to defend against them. Security needs to extend throughout a chip’s lifetime, but it’s ...

Explore how designers can build safer, smarter humanoid robots-covering motor control, main compute, zone control, battery management, charging and sensing. Download the application presentation to ...

Implementing the Cyber Resilience Act: Practical Guidance for Security Engineering and Compliance is a practical eBook designed to help product manufacturers, security teams, compliance leaders, and ...