These are Qualcomm's next-generation AI inference-optimized solutions for data centers, and they bring with them support for ...
Over the past decades, electronics engineers have developed a wide range of memory devices that can safely and efficiently ...
In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...
A new technical paper titled “Benchmarking of FERAM-Based Memory System by Optimizing Ferroelectric Device Model” was published by researchers at Georgia Tech, imec and National Technical University ...
A popular mushroom species can be trained to remember past electrical states, allowing it to act as both a memory device and data processor known as an organic memristor. Scaling performance may be a ...