Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.

Amkor, an Arizona-based company, plans to invest $2 billion in the northwest Valley by building a state-of-the-art facility.

Alpha & Omega Semiconductor Ltd. engages in the construction and operation of power semiconductor packaging, testing, and wafer fabrication facilities. It operates through the following ...

LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that ...

The US-JOINT consortium, formed of semiconductor suppliers looking to advanced packaging and back-end processing technologies ...

Multinational technology company 3M has joined the US-JOINT Consortium, a group of 12 semiconductor suppliers focused on ...

DuPont cited continued recovery in semiconductor demand, driven primarily by AI-technology applications and stronger demand ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design ...

India’s bold semiconductor push aims to shatter global monopolies and establish self-reliance in chip manufacturing.