Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.

Amkor, an Arizona-based company, plans to invest $2 billion in the northwest Valley by building a state-of-the-art facility.

Alpha & Omega Semiconductor Ltd. engages in the construction and operation of power semiconductor packaging, testing, and wafer fabrication facilities. It operates through the following ...

Focusses on Advanced IC-Substrates and Next Generation Wafer-Level Packaging ...

Multinational technology company 3M has joined the US-JOINT Consortium, a group of 12 semiconductor suppliers focused on ...

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...