Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...

YorChip’s CTO and founder, Frank Dunlap said, “The Universal PHYTM design is optimized for power (5X) lower than UCIe-SP, ...

With advanced NoC tools, SoC designers will be able to address escalating design requirements with greater efficiency.

Shares of Nvidia Corp. ( NVDA, Financial) fell more than 3% on Friday as investors worried about growing competition from ...

A chip industrial professional surnamed Zhu said China's localization rate of chip packaging is indeed showing an increasing ... Institute of Applied Economics of the Shanghai Academy of Social ...

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

Advanced packaging with glass is a crucial future technology for the semiconductor industry. Glass is significantly cheaper than silicon. This will enable manufacturers to reduce production costs and ...

The Fraunhofer Institute for Reliability and Microintegration IZM announces its active contribution to the APECS pilot line launched as part of the EU Chips Acts. APECS intends to promote the ...

Nvidia CEO Jensen Huang attended the inauguration, underscoring the partnership in advancing AI chip packaging technology. Taiwan's electronics industry stands to benefit from AI and robotics ...

This move is part of the US’s ongoing efforts to limit China’s ability to develop military and surveillance technology using advanced chips. On Wednesday, the US Commerce Department added 25 companies ...

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked ...

Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...