Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...

In the race to extend Moore’s Law through advanced packaging, the limits of precision are no longer defined solely by lithography. Increasingly, they are dictated by the unpredictable behavior of ...

Application-Specific Cutting Solutions Driven by Advanced Engineering and Custom Design IRVINE,CALIFORNIA, CA, UNITED ...

Agricultural films are essential for boosting land productivity, yet their widespread use has raised significant ecological concerns. To address these challenges, accurate mapping of agricultural ...