A new technical paper titled “Ultrafast visual perception beyond human capabilities enabled by motion analysis using synaptic ...
A technical paper titled “Test Generation for Subcircuits with High Functional Switching Activities” was published by Irith Pomeranz at Purdue University. Abstract “Chip aging results in defects that ...
This integration addresses the fundamental barriers that have historically limited formal verification adoption: complexity ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
As demand for data center compute accelerates, power efficiency has become the defining metric for modern CPUs, GPUs, and AI ...
A new technical paper titled “Advances in You Only Look Once (YOLO) algorithms for lane and object detection in autonomous ...
How much of the energy consumed in an AI chip is spent doing something useful? This question affects everything from software ...
In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...
Reliability is now a system-level concern that includes everything from materials and packaging to testing with backside power.
A new technical paper titled “Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding” was published by ...
Version 3.0 of the interconnect standard doubles bandwidth and supports new use cases and enhanced manageability.
Researchers from Fudan University designed a fiber integrated circuit (FIC) with a multilayered spiral architecture. The ...
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