The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging ...

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to ...

A US$7 billion Micron advanced packaging facility in Singapore will help manufacture high-bandwidth memory (HBM) chips in ...

The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...

Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.