It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to ...

Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

American tech giant Micron Technology has broken ground for what will be Singapore’s first plant producing advanced ...

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...

Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's ...