3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

Advancements in technology have led to the development of increasingly complex and densely integrated circuits (ICs). To keep up with the ever-growing demand for high-performance and power-efficient ...