FREMONT, Calif.–Lam Research Corp. here today introduced a new platen for its 200-mm wafer chemical mechanical planarization (CMP) system designed to extend reliable control of polishing processes ...

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...

ENTG rides AI-driven node migration as advanced chips raise contamination-control needs, boosting consumables demand across filtration, CMP, and etch.

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

This will expand the role of advanced CMP consumables, high-precision metrology, and contamination control. Epi wafers gain strategic value As device architectures become more demanding, epi quality ...

SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on their 6EZ chemical mechanical polishing platform. The 6EZ has ...

As demand for device slips below 0.18m m, are relying more machinable help get silicon wafers through the fab line quickly with less consumable costs and fewer defects per wafer. OEMs and fabs want to ...