As servers, routers and switching equipment shrink, managing the demand for more power in smaller packages is becoming an even bigger challenge for OEMs. Unlike signal connectors, which continue to ...

Experts at the Table: Semiconductor Engineering sat down to discuss power integrity challenges and best practices in designs at 7nm and below, and in 2.5D and 3D-IC packages, with Chip Stratakos, ...

The internet-of-things, or IoT, a fast-developing application space, is forecast to grow to 50B devices by 2020. Figure 1 illustrates a smart home segment of this market. Devices communicate with each ...

For many years, power systems could be easily boiled down to a discussion of volts and amps. But for the past decade, the move to higher operating frequencies has brought another wrinkle to the power ...

Signal integrity (SI) and power integrity (PI) are two distinct but related realms of analysis concerned with proper operation of digital circuits. In signal integrity, the main concern is making sure ...

To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an ...