Despite being the first to adopt the gate-all-around (GAA) technology, Samsung has struggled with commercialization and yield issues and its foundry market share has dropped below 10%. Han Jin-Man, ...
TL;DR: Intel's 18A process node, set for tape-out in 1H 2025, aims to compete with TSMC, marking a significant comeback for Intel in the semiconductor industry. Featuring BSPDN, RibbonFET GAA ...
However, there have been hints Intel may insert high-NA earlier into its 18A node, which is ramping up today. There's a ...
A new process design kit (PDK) from imec aims to provide broad access to a 2-nm gate-all-around (GAA) process node and associated backside connectivity for design pathfinding, system research, and ...
Intel has penciled in that it will be making the world's best chips later this year, beating TSMC, and teasing its next-gen Intel 14A process node that will go into production in 2026. The latest ...
At its Vision 2025 conference, Intel announced today that it has entered risk production of its 18A process node. This crucial production milestone signifies that the node is now in the early stages ...
In the semiconductor industry, where technological progress is measured in nanometers, career advancement follows a distinctive trajectory. At TSMC Arizona, engineers don't just climb a traditional ...
The transition to the 2nm technology node introduces unprecedented challenges in Automated Test Equipment (ATE) bring-up and manufacturability. As semiconductor devices scale down, the complexity of ...
Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec has more than 6.000 employees and top researchers, for R&D in advanced semiconductor and system ...
Intel stock’s foundry business faces a moment of truth in 2025, as it looks to commercialize its cutting-edge 18A process - widely seen as a make-or-break semiconductor fabrication process. Intel has ...
Intel has released details on a new interconnect approach that it's using for future FPGAs, and could make available in CPUs as well, if demand is significant. Share on Facebook (opens in a new window ...
As complementary metal-oxide semiconductor (CMOS) area shrinks 50% from one node to the next, interconnect critical dimensions (CD) and pitch (or spacing) are under tight demands. At the N3 node, ...
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