Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.

Amkor, an Arizona-based company, plans to invest $2 billion in the northwest Valley by building a state-of-the-art facility.

LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that ...

Alpha & Omega Semiconductor Ltd. engages in the construction and operation of power semiconductor packaging, testing, and wafer fabrication facilities. It operates through the following ...

Multinational technology company 3M has joined the US-JOINT Consortium, a group of 12 semiconductor suppliers focused on ...

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design ...