The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

With advanced NoC tools, SoC designers will be able to address escalating design requirements with greater efficiency.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Flip chip packaging is a widely used technology in the electronics industry, allowing for efficient connections between semiconductor chips and circuit boards. This method involves flipping the ...

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

Shares of Nvidia Corp. ( NVDA, Financial) fell more than 3% on Friday as investors worried about growing competition from ...

YorChip’s CTO and founder, Frank Dunlap said, “The Universal PHYTM design is optimized for power (5X) lower than UCIe-SP, ...

GlobalFoundries is now planning to build a $575 million chip packaging and testing center at the site as well. GlobalFoundries CEO Thomas Caulfield, left, and Gov. Kathy Hochul, right, stop for a ...

GlobalFoundries (GFS) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New ...