Applied Materials has agreed to acquire the NEXX business from ASMPT Limited, expanding its advanced packaging tools for AI chipmaking. The deal adds panel level advanced packaging capabilities to ...

Microsoft has released a major update for its MSIX Packaging Tool. The new update brings support for portable apps, new Package Editor improvements, child process monitoring, and more. Microsoft today ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

Intel’s embedded multi-die interconnect bridge (EMIB) technology—aiming to address the growing complexity in heterogeneously integrated multi-chip and multi-chip (let) architectures—made waves at this ...