The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on ...

Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...

Chinese manufacturing giant, Huawei, is doing quite well in the industry. Because Huawei is a multinational company, the U.S. ban did not have much effect on the company's operation. Yes, the ban is ...

“Performance requirements for computing applications are increasing in order to enable more content such as broadband mobile video and 4G communications,” said ...

As AI systems push HBM into terabit-per-second territory, memory test strategy is becoming a core part of system design.