Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

A prototyping problem is emerging in today’s efforts to electrify everything. What works as a lab-bench mockup breaks in reality. Harnessing and safely storing energy at grid scale and in cars, trucks ...

A physics informed machine learning model predicts thermal conductivity from infrared images in milliseconds, enabling fast, ...

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...

Ansys® RedHawk-SC™ is certified for TSMC's advanced 3nm process technology Ansys' comprehensive power, thermal, and reliability analysis enables mutual customers to meet key requirements for ...

Soon after computers entered the technology landscape, finiteelement analysis (FEA) emerged as a method to solve real-world engineering problems. The work of engineers, applied mathematicians, and ...

Complex technologies are forcing automotive engineers to work in areas outside their fields of expertise. A mechanical engineer, for instance, can be called upon to use electronics, fluid dynamics and ...