As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
AI/ML is creeping into multiple processes within the fab and packaging houses, although not necessarily for the purpose it was originally intended. The chip industry is just beginning to learn where ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
San Francisco, CA. KLA-Tencor chose SEMICON West to highlight six new wafer-defect inspection and review systems for leading-edge IC device manufacturing: the 3900 Series (previously referred to as ...
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