As much of the industry moves toward lead-free processes, gold wire is emerging as an alternative. For example, Palomar Technologies' Model 8000 gold ball-and-stitch thermosonic wire bonder is now ...

IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...

The HTH series of ultra-high-precision Bulk Metal Z1-Foil hybrid surface-mount chip resistors connected using gold wire bonding targets high-temperature applications to 240°C. The series also offers ...

“Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire ...

Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...