TOKYO — Fujitsu Ltd. today (March 13) disclosed plans to accelerate expansion of its wafer-bumping and flip-chip packaging capacity for high-end ASICs, digital signal processors, programmable logic, ...
MILPITAS, Calif. — LSI Logic Corp. today announced it has licensed its organic laminate flip-chip ball-grid array (FBGA) technology to Advanced Interconnect Technologies of Pleasanton, Calif., which ...
A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...
Fine pitch copper (Cu) pillar bump adoption has been growing in high-performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very ...
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