For a long time, semiconductor defect inspection focused on particles, and particle defects remain an important cause of yield loss. But as devices have become more complex, additional kinds of ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

MILPITAS, Calif., July 8, 2019 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the 392x and 295x optical defect inspection systems and the eDR7380™ e-beam defect review system. The new ...

MILPITAS, Calif.--(BUSINESS WIRE)--Today KLA-Tencor Corporation (NASDAQ:KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related ...

AI plays a role in improving defect capture rate and distinguishing between yield-killing and nuisance defects. New developments in wafer edge inspection are proving essential to bonded wafer yields.

The Atomic Force Microscope (AFM) has evolved from an extremely high resolution scientific research instrument into a highly accurate metrology tool. This evolution has broadened the role of the AFM ...

Borescopic visual inspection may be appropriate for small parts with areas not visible to the naked eye. Even with all the high-tech testing and inspection techniques in use today, basic visual ...

insights from industryDr. Thomas FriesFounder and CEOFRT GmbH In this article, AZoM, talks to Dr. Thomas Fries, Founder and CEO of FRT GmbH, about the applications of both defect inspection and ...

Business competition pressures manufacturers to produce faster, reduce expenses, and increase efficiencies. But all these requirements run into the quality control issue sooner or later — with the ...

As the mileage of subway is increasing rapidly, there is an urgent need for automatic subway tunnel inspection equipment to ensure the efficiency and frequency of daily tunnel inspection. The subway ...

San Francisco, CA. KLA-Tencor today announced two new defect-inspection products, addressing key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the ...