EDN

X-FAB Rolls Out Trench-Isolated SOI CMOS Process

To reduce die size by up to 40 percent, Erfurt, Germany-based analog/mixed-signal foundry X-FAB Semiconductor Foundries AG Tuesday announced XT06, its 0.6-micrometer silicon-on-insulator (SOI) CMOS ...
EDN

X-Fab launches high-temperature CMOS process

LONDON — Analog/mixed signal foundry X-Fab (Erfurt, Germany) offers a production process for chips that need to operate at high temperatures beyond the normal military operating limit. The XA035 mixed ...
Semiconductor Engineering

Impact of CMOS Image Sensors Fabrication Processes On The Quality Of Smartphone Pictures

A technical paper titled “A Review of the Recent Developments in the Fabrication Processes of CMOS Image Sensors for Smartphones” was published by researchers at Texas A&M University. “CMOS Image ...
ExtremeTech

IBM builds graphene chip that's 10,000 times faster, using standard CMOS processes

Engineers at IBM Research are claiming to have built the world's most advanced graphene-based computer chip, with performance that's 10,000 times better than previous graphene ICs. The key to the ...
TechNewsWorld

Luxtera Delivers CMOS Photonics Technology

Fabless semiconductor company Luxtera announced today that it has solved the longstanding problem of building advanced photonic interfaces into mass-produced silicon chips. The company claimed that, ...
Electronic Design

X-FAB Brings First CMOS Fab To Brazil

The Brazilian government and X-FAB Silicon Foundries have signed an agreement to bring semiconductor manufacturing to Brazil. Brazil's government-backed Excellence Center for Advanced Electronic ...
Semiconductor Engineering

Process Variation Analysis Of Device Performance Using Virtual Fabrication — Methodology Demonstrated On A CMOS 14-nm FinFET Vehicle

A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
Electronic Design

Surface-Micromachined CMOS Process Enhances IC Tire-Pressure Sensor

An innovative design by Motorola's Sensor Products Division in Tempe, Ariz., optimally integrates a surface-micromachined capacitive automotive tire-pressure sensor with a 0.8-µm CMOS double-metal, ...
AZOM

Semiconductor Integration with MEMS: Fabrication and Applications

MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...