Semiconductor Packaging News
WEBSemiconductor Engineering. ASML needs license for some services in China. The Dutch government now requires ASML Holding NV to obtain licenses for servicing chipmaking equipment sold to China, including spare parts and software. New restrictions begin on Sept. 6, expanding to ASML’s 1980di and 1970di machines.
Semiconductor Packaging News
WEBResearch Bits: Aug. 27. Nagoya Univ. researchers have developed a more eco-friendly and cost-effective method to grow gallium nitride semiconductors without ammonia. Their radical-enhanced metalorganic chemical vapor deposition technique reduces temps, uses less toxic gases & speeds up the process. Semiconductor Engineering.
Semiconductor Packaging News
WEBBroadcom says it will sell $12 billion in AI parts and custom chips this year. Broadcom exceeded Wall Street's third-quarter expectations for revenue and earnings, but a $1.88 billion net loss from a tax provision led to a 7% drop in shares. Despite strong AI and semiconductor sales, revenue guidance met expectations at $14 billion.
Semiconductor Packaging News Index
WEBNews Index. 23701 news listings. To search a phrase, place it in quotes. Japanese semiconductor equipment giants Tokyo Electron and Screen Holdings have seen significant revenue growth from China, with over 50% of ... India and Singapore's recent agreements bolster India's semiconductor ecosystem, with new investments from Kaynes Semicon and ...
Semiconductor Packaging News
WEBTSMC sales rise on AI demand. Taiwan Semiconductor Manufacturing Co (TSMC) reported a 33% revenue rise year-on-year in August, reaching NT$250.87 billion. This growth, fueled by demand for Nvidia’s AI chips and smartphones, positions TSMC to exceed third-quarter revenue projections by 5-6%. Taipei Times.
TSMC Begins Small-Scale Production in Arizona for Apple's A16 …
WEB1 day ago · TSMC's Arizona fab has started trial production of Apple's A16 chip using the 5nm N4P process, a significant milestone. Tim Culpan reports the facility aims to scale up once Phase 1 is complete, with mass production set for 2025. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
Semiconductor Packaging News Technical Paper Index
WEBORC Manufacturing CO., LTD. Jul 31, 2024. Advanced Packaging for Next-Generation Vehicle. Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging ... Amkor Technology, Inc. Jul 24, 2024.
Will 2024 be the Year of Advanced Packaging?
WEBWill 2024 be the Year of Advanced Packaging? IDTechEx's report highlights how advanced packaging technologies like 2.5D & 3D are boosting semiconductor innovation. These methods improve chiplet integration & system performance, paving the way for breakthroughs in AI, 5G & data centers despite material & cost challenges.
Intel Glass Core Substrate Update - Semiconductor Packaging News
WEBIntel Glass Core Substrate Update. INEMI hosted a webinar spotlighting Glass Substrates for Advanced Packaging, showcasing Intel's pioneering work. Dr. Dilan Seneviratne and Dr. Gang Duan of Intel detailed the company's strategic focus on glass core substrates, integral to their Advanced Packaging roadmap unveiled in September 2023.
Advanced Packaging Drives New Memory Solutions for the AI Era
WEB1 day ago · Advanced Packaging Drives New Memory Solutions for the AI Era. AI is fueling demand for more computing power and advanced memory technologies like High-Bandwidth Memory (HBM). Lam Research, a leader in advanced packaging solutions, collaborates with NVIDIA and Intel to enhance HBM performance for AI's data needs.
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